nX-FM1

The wafer warpage measurement system performs high-speed scanning to measure the entire shape of a 12-inch wafer in just 5 seconds. It is a process-reference equipment that provides full-surface shape data and 3D images at a high throughput level for process control in Advanced Wafer-Level Packaging (AWLP). This system is capable of measuring wafers with significant warpage, which was challenging with conventional methods. It supports shape measurement for various types of wafers, including bare wafers, patterned wafers, bonded wafers, and glass wafers. The resulting comprehensive wafer data, along with high-resolution 3D images and analysis, will serve as crucial process data to enhance yield.