AVP System
A 300mm wafer measurement system that automatically measures various applications such as bump height, RDL, CD, TIR, thin film thickness, thin film surface shape measurement and die bending, die surface roughness, die surface micro shape measurement, TSV hole diameter, depth, etc., which are indispensable measurements in advanced packaging processes.
Different optical systems allow you to make different types of measurements to save time and money.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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