3D Interferometric-Sensors
nXI-5C
Interference Measurement Sensor - Compact
Ultra-Precision, 3D Measurement of Microstructure
It is highly convenient to apply the advanced measurement technology, which offers a high level of reliability in the results, with a much faster measurement speed
than before in mass production lines. It can measure deviations, thickness, and
illumination, and is used to measure microstructures of semiconductors, column
spacers in bumps and displays, surface structures, and bumps caused by foreign
substances, all with a resolution of less than a micrometer (μm).
Specifications
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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